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WHY 3-D INTERCONNECTS?
On-chip and off-chip interconnects can be the limiting factors dominating the performance and cost of future electronic components in high-performance integrated circuits. Three-dimensional integration can result in shorter chip-to chip interconnects, reduced parasitic effects, faster signal processing and reduced power consumption. Through-wafer interconnects are a critical technology for 3-D stacking of electronic chips. 3-D stacking reduces the performance bottleneck associated with traditional, inherently long 2-D chip to chip interconnects. The small lead lengths associated with through wafer vias will increase the overall device speed, decrease power requirements and decrease analog noise and cross-talk. In addition to making electronic chip stacking possible, through wafer interconnects allow for the stacking of more than two chips and for heterogeneous integration of chips, for example, optoelectronic devices grown on GaAs with conventional Si IC’s.
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