Equipment Characterization
Oxidation
Process Control Chart
45min at 30% O2 with temp = 1000 deg.C will yield
approx. 1000 Angstroms of oxide
Available Sputter Targets and Deposition
Rates
Expected deposition rates
using CrC150 (some target dep rates are unknown at this time)
| Material |
DC Power |
Deposition Pressure |
Rate (A/min) |
| Al |
50W |
5 mTorr |
70 |
| Au |
20W |
5 mTorr |
150 |
| Ni |
50W |
5 mTorr |
40 |
| Pd |
50W |
5 mTorr |
|
| Cu |
|
5 mTorr |
|
| Ti |
50W |
5 mTorr |
30 |
| Cr |
50W |
5 mTorr |
83 |
Chemical Mechanical
Characterization
Expected copper removal
rates using process parameters shown below
| Slurry |
Pad |
TS/SS(rpm) |
Down Force (psi) |
Removal Rate(um/min) |
| Fujimi Planarlite |
TWI |
60/60 |
1-3 |
1 |
| Cabot 5003 |
TWI |
60/60 |
1-3 |
0.5 |
| |
|
|
|
|
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