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Thermal Evaporator

Image of the CHA thermal evaporator Description:
 The thermal evaporator uses resistive energy to evaporate thin films onto a given substrate. It can deposit materials with a specified thickness of up to 1500 nanometers. The thickness is controlled by the use of a quartz crystal monitor.  Three 8″ wafers can be processed simultaneously and tooling is being developed for additional sizes. Up to three different layers may be evaporated in one run.

Manufacturer: CHA

Operation Procedure

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