Equipment Characterization
Oxidation
45min at 30% O2 with temp = 1000 deg.C will yield approx. 1000 Angstroms of oxide
Available Sputter Targets and Deposition Rates
Expected deposition rates using CrC150 (some target dep rates are unknown at this time)
| Material | DC Power | Deposition Pressure | Rate (A/min) |
| Al | 50W | 5 mTorr | 70 |
| Au | 20W | 5 mTorr | 150 |
| Ni | 50W | 5 mTorr | 40 |
| Pd | 50W | 5 mTorr | |
| Cu | 5 mTorr | ||
| Ti | 50W | 5 mTorr | 30 |
| Cr | 50W | 5 mTorr | 83 |
Chemical Mechanical Characterization
Expected copper removal rates using process parameters shown below
| Slurry | Pad | TS/SS(rpm) | Down Force (psi) | Removal Rate(um/min) |
| Fujimi Planarlite | TWI | 60/60 | 1-3 | 1 |
| Cabot 5003 | TWI | 60/60 | 1-3 | 0.5 |