Craig is a graduate of The University of Arizona with a degree in chemical engineering and comes to Boise State University directly from the semiconductor manufacturing industry where he was most recently a physical vapor deposition process engineer for Micron Technology. There he was responsible for metal deposition processes for DRAM and NAND technology. Responsibilities included troubleshooting line issues and developing solutions, long term process improvement and increasing tool uptime among others.
As the process owner, Craig was also expected to be the technical expert for metals processing to whom all other engineers would go for advice and expertise. For this reason Craig began investigating the Materials Science and Engineering program at Boise State University to improve his solid state chemistry and physics skills.
Prior to working for Micron Technology, Craig worked for Motorola and ON Semiconductor in Phoenix, Arizona. There he started out as a diffusion process engineer and eventually became a device engineer with ownership of wafer level device lines. In this capacity Craig coordinated between the manufacturing fab, assembly and final test to ensure the devices were functional and had high yields from wafer start to the final packaged device.
Currently Craig is with the DNA Nanotechnology Team working on scaling up DNA origami. Upon graduation, Craig hopes to return to process engineering in a development capacity in the biomedical field