Through Wafer Interconnects
We are developing polymer and biological sensors using 3D and electron beam lithography fabrication techniques. This is related to our biomaterials research.
Projects
- Through-waver interconnect reliability
- Continuity and void detection
- Plasma induced damage (PID)
- Environmental reliability
- TWI Applications
- Device applications & 3D microstructures
Students
*: 2003 Micron Campus Engineering Research Program (undergraduate summer research)
+: Awarded Best Research Poster-College of Engineering at 2004 Boise State University Undergraduate Research Conference
Collaboration
- PI: ProfessorA. J. Moll (Materials Science & Engineering)
- Dr. Sean Donovan (Materials Science & Engineering)
- Dr. Wan Kuang (Electrical & Computer Engineering)
- Dr. Peter Mullner (Materials Science & Engineering)
- Dr. Megan Frary (Materials Science & Engineering)