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Researcher Profiles

We have a diverse body of faculty researchers.  Below are brief profiles introducing you to just a few of the folks you will meet at the ECE Industry Forum 2017.  Check out our faculty directory for detailed faculty profiles from across our department.  

Kurtis Cantley, Electrical and Computer Engineering Department

Dr. Kurtis Cantley joined Boise State in 2013 after earning his PhD from the University of Texas at Dallas. His expertise is in the area of fabrication and electrical characterization of semiconductor materials, devices, and circuits. He is especially interested in the use of novel devices for artificial neural systems and interfaces. Since joining Boise State, Cantley has received a Young Investigator Award from the Air Force Office of Scientific Research (AFOSR), as well as a $1.5 million grant from the Idaho Global Entrepreneurial Mission (IGEM) program.

David Estrada, Micron School of Materials Science and Engineering

Idaho native Dr. David Estrada is co-director of the Advanced Nanomaterials and Manufacturing Lab (ANML) at Boise State. Grounded in the belief that nanotechnology and innovations in manufacturing will enable our world to tackle many of the daunting challenges we face, Estrada’s research is devoted to developing material and manufacturing solutions for complex problems. Targeting concerns such as increasing energy demands and rising healthcare costs, Estrada’s team is currently developing nano-engineered and multifunctional inks for additive manufacturing of printed/flexible electronics and sensors.

Sin Ming Loo, Electrical and Computer Engineering Department

Dr. Sin Ming Loo, director of the Hartman Systems Integration Lab, specializes in embedded systems, sensor networks, and reconfigurable computing. Currently, he is developing a machine-to-machine (M2M) sensor adapter, a device/protocol adapter which will improve collection, modification and delivery of remotely sensed GPS, vehicle diagnostics, and related data. The M2M Sensor Adapter fills a critical gap in the collection and delivery of data from diverse sensors to the cloud for use by a wide variety of applications.

Maria Mitkova, Electrical and Computer Engineering Department

Leading the Nanoionic Materials and Devices group, Dr. Maria Mitkova is currently collaborating with Idaho National Lab to develop radiation sensors capable of real-time detection. Mitkova is also working towards new memory solutions licensed by Micron Technology to increase the reliability and switching speed of devices.

Hani Mehrpouyan, Electrical and Computer Engineering Department

Dr. Hani Mehrpouyan’s research interests include millimeter-wave systems, hybrid computing for simulating complex communication systems and reconfigurable antennas. Current collaborations focus on designing a new class of reconfigurable antennas for the millimeter-wave band that further open this spectrum for use. He is also working closely with Dr. Harish Subbaraman to design reconfigurable antennas via flexible semiconductors and electronics. Antennas that will operate at such high frequencies (30-300 GHz) are significantly smaller than the ones currently used at lower frequencies. Dr. Mehrpouyan expects that these flexible electronics will play a key role in reducing the size and costs of such antennas.

Harish Subbaraman, Electrical and Computer Engineering Department

Dr. Harish Subbaraman was hired in fall 2016 to support the IGEM initiative. Prior to joining Boise State, Subbaraman specilaized in printed and flexible photonics/electronics as well as silicon and polymer based optical interconnects. Subbaraman is currently focused on the use of ink-jet printing and screen printing at Boise State to advance flexible electronics applications in sensing and energy harvesting. He is also committed to developing a shared-use, high-rate, roll-to-roll printer at Boise State. Once developed, the tool will greatly exceed state-of-the-art benchtop additive printer speed and functionality by enabling researchers to print experimental materials as well as large format, multi-material and near production-ready flexible electronic prototypes and systems.