Amy J. Moll, Ph.D.

Dr. Amy J. Moll joined the College of Engineering faculty at Boise State in August, 2000. Dr. Moll received a B.S. degree in Ceramic Engineering from University of Illinois, Urbana IL, in 1987. Her M.S. and Ph.D. degrees are in Materials Science and Engineering from University of California at Berkeley, received in 1992 and 1994, respectively. Following graduate school, Dr. Moll worked for Hewlett Packard for six years in San Jose, CA, and in Colorado Springs, CO. She was an Adjunct Professor at San Jose State University and has been involved in several conferences and workshops on Materials Science and Engineering education.

Dr. Moll was a co-founder of the Materials Science and Engineering department at BSU along with Dr. Bill Knowlton. She served as the first chair of the department from 2004-2008 . The Department of Materials Science and Engineering offers B.S., M.S., and M.Eng degrees as well as a minor for undergraduates.

Dr. Moll has experience in R&D and manufacturing of microelectronic materials and packaging. At Boise State, Dr. Moll is conducting research in microelectronic packaging. Her funding includes a project to investigate 3D Technology for Advanced Sensor Systems and the application of low temperature co-fired ceramic materials (LTCC) to micro analytical and micro-mechanical systems. Dr. Moll is also involved in several grants and projects focused on improving STEM education and a variety of levels and informing the public about Material Science and Engineering.

• RECENT PUBLICATIONS
• Patrick Andersen, Mariela Bentancur, Amy Moll, and Megan Frary, "Microstructural Effects during Chemical Mechanical Planarization of Copper", Journal of the Electrochemical Society, 157, H120 (2010)
• S.Y. Chyung, A.J. Moll, J. Callahan, M. Frary and B. Marx, "Improving Engineering Students' Cognitive and Affective Preparedness with a Pre-Instructional E-Learning Strategy," Advances in Engineering Education, 10 (1) 22-37 (2010)
• D.L. Kellis, A.J. Moll and D.G. Plumlee, “Effects of silver paste application on embedded channels in low temperature co-fired ceramics”, Journal of Microelectronics and Electronic Packaging, accepted for publication (June, Volume 6) (2009).
• J. Jozwiak, R.G. Southwick III, V.N. Johnson, W.B. Knowlton, and A.J. Moll, “Integrating Through-Wafer Interconnects with Active Device and Circuits,” IEEE Transactions on Advanced Packaging, 31 (1) 4-13 (2008).
• D. Plumlee, J. Steciak, and A. Moll, “Development and Simulation of an Embedded Hydrogen Peroxide Catalyst Chamber in Low Temperature Co-fired Ceramics,” International Journal of Applied Ceramic Technology, 4 (5) 406-414 (2007).
• J. Youngsman, B. M. Marx, S. Wolter, J. Glass, A.J. Moll “Miniature Multi-electrode Electrochemical Cell in LTCC,” Journal of Microelectronics and Electronic Packaging, 4 (1) 31-36 (2007).
• K. Moeller, J. Besecker, G. Hampikian, A. Moll, D. Plumlee, J. Youngsman and J.M. Hampikian, "A prototype continuous flow polymerase chain reaction LTCC device," Materials Science Forum, 2007, Vols. 539-543, 523-528.
• P.A. Miranda, J. Imonigie, and A.J. Moll, “Through-Wafer Interconnect CMP: An Investigation of Slurry Interaction Effects using a Design of Experiments Approach,” Journal of the Electrochemical Society, 153 (3) G211-G217 (2006)

• Dr. Moll has experience in R&D and manufacturing of microelectronic materials and packaging. At Boise State, Dr. Moll is conducting research in microelectronic packaging and ceramic microfluidic and micro analytical systems. Dr. Moll is also involved in several projects to improve STEM education.
• CURRENT GRANTS
• 3-D Technology for Advanced Sensor Systems, SPAWAR/DARPA Collaborators: Knowlton, Kuang, Hughes, Yurke, Müllner
• STEM Education for All: Building a Vision for Sustaining Innovation and Prosperity, NSF Collaborators: Nadelson, Charlier, Morgan
• Idaho Engineering Scholarship Program and Idaho Engineering Scholarship Program Expanded Opportunities, NSF Collaborators: Callahan, Loo, Jain, Khanal
• Improved Packaging and Thermal Management for High Power VCSEL Diode Arrays, MDA Collaborators: Aerius Photonics, Inc., Research Triangle Institute Electrical Propulsion in Low Temperature Co-Fired Ceramic Materials, NASA Collaborators: Plumlee, Browning, Senocak