The Holcombe Department of Electrical & Computer Engineering at Clemson University is seeking applicants for a summer Research Experiences for Undergraduates (REU) program. This NSF funded program is entitled: “REU Site: Solid-State Devices for Electronics, Photonics, and Magnetics Technology”. The REU supports up to 10 summer students, typically with one to four semesters remaining in their undergraduate programs, to become involved with a faculty member and graduate students for a 10 week research experience at Clemson. The program is open to undergraduate students in Electrical and Computer Engineering, Materials Science, Bioengineering, and Physics. Closely related disciplines may also be considered. The program provides summer housing on campus for the students and pays a generous stipend.
Key Dates and Deadlines:
- February 15, 2019: Priority Application Deadline – Applications will be evaluated upon receipt
- May 20, 2019: Program Begins
- July 26, 2019: Program Ends
- Undergraduate students at accredited U.S. institutions.
- Majors Sought:
- Electrical & Computer Engineering
- Materials Science and Engineering
- Closely Related Disciplines
- Typically one to four academic semesters remaining until graduation at the time of participation
- U.S. citizenship or permanent-resident status
- Minimum grade point average of 3.0 out of 4.0
Competitive Compensation for SURE Participants:
- The stipend is $6,000 for the 10-week program.
- Free on-campus housing is provided.
- There is a relocation allowance for students not already enrolled at Clemson.
The Clemson SURE Program is supported by the National Science Foundation (EEC-1560070)