Materials-related research at Boise State benefits from a broad range of cutting-edge research tools. Some of the facilities MSE faculty and students have access to are noted below. Additionally, a new center for materials research will be available soon, to accommodate accelerated growth in the field of materials science and engineering and at Boise State.
Through the Boise State Center for Materials Characterization (BSCMC,) Idaho Microfabrication Laboratory (IML), Materials Science and Engineering, Physics, Chemistry and Biochemistry, and Geosciences departments, researchers have access to a transmission electron microscope (TEM), x-ray diffraction (XRD) system, several scanning electron microscopes (SEM) equipped with energy dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD) systems, x-ray photoelectron spectroscopy (XPS), nuclear magnetic resonance (NMR), isotope dilution thermal ion mass spectrometer (ID-TIMS), atomic force microscopy (AFM), laser ablation inductively coupled plasma mass spectrometry (LA-ICPMS), and Raman spectroscopy.
At the Imaging Center at the Center for Advanced Energy Studies (CAES) in Idaho Falls, Boise State researchers can access a local electrode atom probe (LEAP), TEM, SEM, a dual beam SEM/FIB, and a nano-indenter AFM.
Boise State’s mechanical testing capabilities include a hydraulic MTS load frame with high temperature testing capabilities, a bench-top hydraulic MTS load frame, a Zwik test bench for low load testing, microhardness systems, and nanoindentation. At CAES, several hydraulic load frames, a drop weight impact testing system, and microhardness indenter are available.
Thermo-physical Property Measurement
Thermo-physical properties can be studied at Boise State using differential scanning calorimetry (DSC), differential thermal analysis (DTA), thermogravimetric analysis (TGA), combustion element analysis, and electrochemical corrosion analysis.
Electrical and Magnetic Characterization
Boise State’s unique electrical properties characterization relies on an several semiconductor characterization set-ups, one of which allows testing at temperatures below 20 K. For magnetic property measurements, Boise State has a vibrating sample magnetometer (VSM) with temperature control and thin film capabilities.
Boise State has a number of unique materials processing facilities including spark plasma sintering, hot pressing, a rapid prototype lab, a ceramic MEMS processing lab, a microfabrication center for semiconductor processing, numerous sputtering systems for thin film processing, high energy ball milling for powder processing, a tape casting setup, several high temperature controlled atmosphere furnaces, and inert atmosphere gloveboxes.
Thin Film Characterization
To characterize thin film properties, Boise State researchers use optical profilometry and an x-ray reflectometry system for substrate curvature measurement device.
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